Spring clip for retaining thermal contact between an electronic device package and a heat sink



FIG. 1 is a front perspective view of a spring clip for retaining thermal contact between an electronic device package and a heat sink showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a side elevational view thereof, the opposite side view being a mirror image of the view of FIG. 5; and,

FIG. 6 is a bottom plan view of my spring clip for retaining thermal contact between an electronic device package and a heat sink. 

The ornamental design disclosed for a spring clip for retaining thermal contact between an electronic device package and a heat sink, as shown and described. 